Dr.-Ing. Johannes Meyer
- Wissenschaftlicher Mitarbeiter
- Tel.: +49 721 6091 406
- Fax: +49 721 608-45926
- johannes meyer ∂does-not-exist.iosb fraunhofer de
Lebenslauf
Johannes Meyer schloss 2014 sein Masterstudium der Informatik am Karlsruher Institut für Technologie (KIT) ab. Im Jahr 2018 wurde er am KIT zum Dr.-Ing. promovierte. Für seine Doktorarbeit Light Field Methods for the Visual Inspection of Transparent Objects wurde er mit dem Young Professional Award 2019 der European Machine Vision Association ausgezeichnet.
Von 2019 bis 2021 war Meyer als Lead Engineer für Computer Vision bei der Bosch-Tochter ITK Engineering GmbH tätig und hielt mehrere Vorlesungen in theoretischer Informatik an der Dualen Hochschule Baden-Württemberg.
Seit 2021 ist Meyer Leiter der Forschungsgruppe Variable Bildgewinnung und -Verarbeitung (VBV) am Fraunhofer-Institut für Optronik, Systemtechnik und Bildauswertung IOSB.
Sein besonderes Interesse gilt Themen des Computational Imaging wie bspw. Plenoptic Imaging und Compressed Sensing.
Veröffentlichungen
2019
Light Field Methods for the Visual Inspection of Transparent Objects. Dissertation
Meyer, J.
2019. KIT Scientific Publishing. doi:10.5445/KSP/1000091872
Meyer, J.
2019. KIT Scientific Publishing. doi:10.5445/KSP/1000091872
Light Field Methods for the Visual Inspection of Transparent Objects. Dissertation
Meyer, J.
2019. Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000089292
Meyer, J.
2019. Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000089292
2018
SNR-optimized image fusion for transparent object inspection
Meyer, J.; Melchert, W.; Hartrumpf, M.; Längle, T.; Beyerer, J.
2018. Unconventional Optical Imaging 2018; Strasbourg; France; 22 April 2018 through 26 April 2018, Art. Nr.: 106770A, Society of Photo-optical Instrumentation Engineers (SPIE). doi:10.1117/12.2307392
Meyer, J.; Melchert, W.; Hartrumpf, M.; Längle, T.; Beyerer, J.
2018. Unconventional Optical Imaging 2018; Strasbourg; France; 22 April 2018 through 26 April 2018, Art. Nr.: 106770A, Society of Photo-optical Instrumentation Engineers (SPIE). doi:10.1117/12.2307392
Towards light transport matrix processing for transparent object inspection
Meyer, J.; Längle, T.; Beyerer, J.
2018. Proceedings of the Computing Conference 2017, London, UK, 18th - 20th July 2017, 244–248, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SAI.2017.8252110
Meyer, J.; Längle, T.; Beyerer, J.
2018. Proceedings of the Computing Conference 2017, London, UK, 18th - 20th July 2017, 244–248, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SAI.2017.8252110
2017
Next on Stage : ‘MC ViSi’ - a Machine Vision Simulation Framework : An Introduction : Technical Report IES-2016-06
Meyer, J.
2017. Proceedings of the 2016 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision an Fusion Laboratory. Ed.: J. Beyerer, 71–83, KIT Scientific Publishing
Meyer, J.
2017. Proceedings of the 2016 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision an Fusion Laboratory. Ed.: J. Beyerer, 71–83, KIT Scientific Publishing
General Cramér-von Mises, a Helpful Ally for Transparent Object Inspection Using Deflection Maps?
Meyer, J.; Längle, T.; Beyerer, J.
2017. Image Analysis : Proceedings of the 20th Scandinavian Conference (SCIA 2017) Part I, Tromso, Norway, 12-14 June 2017. Ed.: P. Sharma, 526–537, Springer. doi:10.1007/978-3-319-59126-1_44
Meyer, J.; Längle, T.; Beyerer, J.
2017. Image Analysis : Proceedings of the 20th Scandinavian Conference (SCIA 2017) Part I, Tromso, Norway, 12-14 June 2017. Ed.: P. Sharma, 526–537, Springer. doi:10.1007/978-3-319-59126-1_44
2016
Acquiring and processing light deflection maps for transparent object inspection
Meyer, J.; Langle, T.; Beyerer, J.
2016. 2nd International Conference on Frontiers of Signal Processing (ICFSP), Warsaw, PL, October 15-17, 2016, 104–109, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICFSP.2016.7802965
Meyer, J.; Langle, T.; Beyerer, J.
2016. 2nd International Conference on Frontiers of Signal Processing (ICFSP), Warsaw, PL, October 15-17, 2016, 104–109, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICFSP.2016.7802965
About acquiring and processing light transport matrices for transparent object inspection
Meyer, J.; Längle, T.; Beyerer, J.
2016. Technisches Messen, 83 (12), 731–738. doi:10.1515/teme-2016-0042
Meyer, J.; Längle, T.; Beyerer, J.
2016. Technisches Messen, 83 (12), 731–738. doi:10.1515/teme-2016-0042
Erfassung und Verarbeitung von Lichttransportmatrizen zur automatischen Sichtprüfung transparenter Objekte = Acquisition and processing of light transport matrices for automated transparent object inspection
Meyer, J.; Längle, T.; Beyerer, J.
2016. Forum Bildverarbeitung 2016. Hrsg.: M. Heizmann, 75–86, KIT Scientific Publishing
Meyer, J.; Längle, T.; Beyerer, J.
2016. Forum Bildverarbeitung 2016. Hrsg.: M. Heizmann, 75–86, KIT Scientific Publishing
Overview on Machine Vision Methods for Finding Defects in Transparent Objects : Technical Report IES-2015-08
Meyer, J.
2016. Proceedings of the 2015 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision and Fusion Laboratory. Ed.: J. Beyerer, 103–112, KIT Scientific Publishing
Meyer, J.
2016. Proceedings of the 2015 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision and Fusion Laboratory. Ed.: J. Beyerer, 103–112, KIT Scientific Publishing
2015
Visual Inspection of Transparent Objects Physical Basics, Existing Methods and Novel Ideas. Technical Report IES-2014-04
Meyer, J.
2015. Proceedings of the 2014 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision and Fusion Laboratory. Ed.: J. Beyerer, 37–47, KIT Scientific Publishing
Meyer, J.
2015. Proceedings of the 2014 Joint Workshop of Fraunhofer IOSB and Institute for Anthropomatics, Vision and Fusion Laboratory. Ed.: J. Beyerer, 37–47, KIT Scientific Publishing
Utilization of spectral Signatures for daily use. Overview about the State of Affairs. Special Issue, OCM 2015, March 18th/19th, 2015 Karlsruhe, Germany
Schulte, H.; Brink, G.; Gruna, R.; Grüger, H.; Kopf, M.; Meyer, J.; Raidt, E.; Schaudel, S.; Thißen, E.; Walocha, J.
2015. Karlsruher Institut für Technologie (KIT)
Schulte, H.; Brink, G.; Gruna, R.; Grüger, H.; Kopf, M.; Meyer, J.; Raidt, E.; Schaudel, S.; Thißen, E.; Walocha, J.
2015. Karlsruher Institut für Technologie (KIT)